SICE 2027

The 2nd Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition 2027

Date: May 27–29, 2027

Venue: Hangzhou Grand Convention and Exhibition Center-Zhejiang

I. Exhibition Introduction

Driven by the rapid evolution of the global digital economy, artificial intelligence (AI), new energy vehicles (NEVs), and advanced manufacturing, the integrated circuit (IC) industry, as the cornerstone of China's technological self-reliance and innovation, has entered a golden era characterized by accelerated import substitution and coordinated development across the entire industrial value chain.The Yangtze River Delta is home to China's most comprehensive and resource-rich integrated circuit industrial cluster. Hangzhou, renowned as China's leading digital economy hub, possesses unparalleled industrial advantages, bringing together massive end-user demand, world-class universities and research institutions, and diversified industrial capital. Serving as a strategic hub connecting IC design, wafer fabrication, semiconductor packaging and testing, equipment and materials, and a wide range of downstream applications, Hangzhou provides an unparalleled platform for collaborative innovation, precise business matchmaking, and high-quality industrial development.

The Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition 2026 concluded with remarkable success, delivering outstanding results that impressed the entire industry.With a total exhibition area of 30,000 square meters, the event bringing together 173 leading domestic and international enterprises and prestigious research institutions, while connecting more than 600 high-quality upstream and downstream companies across the semiconductor value chain. It attracted over 30,000 professional visitors to attend, with intended cooperation agreements reaching RMB 13.9 billion, demonstrating exceptional commercial achievements. A total of 16 high-level industry forums were held concurrently, creating a comprehensive industrial service platform that integrated exhibitions, conferences, business matchmaking, industrial investment promotion, and talent recruitment. With its highly professional organization and outstanding business outcomes, the exhibition earned widespread recognition and high acclaim from across China's semiconductor industry.

Based on the remarkable achievements of the inaugural edition, the exhibition embarks on a new chapter of industrial innovation. To further establish a world-class platform for global collaboration and industry exchange, the 2nd Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition 2027 has officially opened the global exhibitor registration and recruitment. The exhibition will take place from May 27 to 29, 2027, at the Hangzhou Grand Convention and Exhibition Center. Taking "Gathering Chips in Qiantang, Connecting Intelligence Worldwide" as its theme, relying on Hangzhou's strengths in the digital economy and the robust momentum of the Yangtze River Delta's integrated circuit industry cluster, the event will bring together leading enterprises, innovators, and industry experts from across the global semiconductor value chain to strengthen collaboration, accelerate innovation, and jointly shape the future of China's high-quality semiconductor industry development.

II. Core Mission and Purpose of the Exhibition

Positioned at the core of the Yangtze River Delta, China's premier integrated circuit manufacturing and innovation cluster, and in response to the national strategies for semiconductor self-reliance, technological self-sufficiency, and resilient supply chain development, the show aims to establish a world-class international platform that integrates technology exhibition, business matchmaking, trade collaboration, investment promotion, innovation exchange, and talent development, fostering deeper cooperation across the global semiconductor ecosystem.

• Showcase the entire semiconductor value chain covering IC design, wafer fabrication, packaging & testing, semiconductor equipment and materials, EDA software, advanced packaging, compound semiconductors, and AI chips, highlighting China's latest technological breakthroughs, innovative products, and industrial achievements.

• Facilitate efficient business matching between upstream and downstream enterprises,foster project partnerships and long-term strategic collaborations, and accelerate the commercialization and large-scale deployment of advanced chips and critical semiconductor components in high-growth sectors such as NEVs, humanoid robotics, and advanced medical technologies.

• Promote deeper collaboration among the leading semiconductor clusters across the Yangtze River Delta, including Shanghai, Wuxi, Suzhou, Hangzhou, to enhance regional industrial integration, strengthen supply chain coordination, address critical gaps across the value chain, and build a secure, resilient, and self-reliant domestic semiconductor supply chain ecosystem.

• Bring together academicians, industry experts, leading enterprises, research institutions, venture capital firms, and government representatives to exchange insights on emerging industry trends, tackle key technological challenges, and accelerate the convergence of industry, innovation, capital, talent, and policy, building a collaborative and innovation-driven semiconductor ecosystem.

• Relying on Hangzhou's robust digital economy, extensive downstream application markets, and world-class research universities, the exhibition empowers enterprises to expand market opportunities, strengthen brand influence, attract top-tier talent, secure investment, and accelerate business growth. It further supports the industry's transition toward higher-value manufacturing, intelligent innovation, and greater technological self-reliance.

• Strengthen the global competitiveness of the Yangtze River Delta as a world-class integrated circuit cluster, foster greater connectivity between domestic and international semiconductor ecosystems, deepen China's integration into the global semiconductor value chain, and drive the industry's high-quality development.

III. Building on the Success of the Inaugural Edition, with a Comprehensive Upgrade for 2027

Building on the remarkable achievements of the inaugural edition, the 2nd exhibition returns with a comprehensive upgrade in industry resources, traffic generation, and business matchmaking services.

• Comprehensive Semiconductor Industry Chain Showcase

The exhibits cover the entire semiconductor value chain, including EDA tools, IC design, wafer fabrication, advanced packaging and testing, high-end semiconductor manufacturing equipment, key electronic chemicals, third-generation semiconductors, Chiplet technologies, AI computing chips, computing-in-memory, photonic integration, the RISC-V ecosystem, and a full spectrum of end-use applications across diverse industries.

• Targeted Professional Buyer Invitation Plan

Procurement executives and technical decision-makers from semiconductor manufacturers, OSAT providers, equipment and material suppliers, automotive OEMs, AI computing service providers, medical electronics companies, aerospace enterprises, research institutes, universities, and industrial investment organizations will invited to attend the show with the purpose of visiting and purchasing. Based on rigorous attendee qualification and quality control, the exhibition ensures a high-caliber professional audience, eliminates ineffective traffic, and creates an efficient platform for business networking and commercial collaboration.

• Extensive Global Media Exposure

Powered by a network of more than 300 domestic and international industry media outlets, short-video platforms, livestream channels, and professional publications, the exhibition delivers a comprehensive, full-cycle media campaign that amplifies product launches, technology innovations, and brand stories across multiple channels, helping exhibitors enhance brand visibility, strengthen industry influence, and expand market presence.

• High-Level Concurrent Conferences

During the exhibition, nine premier industry conferences will be held, covering IC talent development, semiconductor innovation, EDA, semiconductor materials and equipment, photonic integration, advanced packaging, intelligent manufacturing, the RISC-V ecosystem, and investment matchmaking. Renowned academicians, industry experts, executives from leading enterprises, and investment leaders will share policy insights, discuss emerging technology trends, and explore pathways for semiconductor localization and industrial innovation.

IV. Exclusive Value-Added Programs for Exhibitors

•  Three Exclusive Industry Supply & Demand Matchmaking Sessions

Exclusive supply and demand matchmaking sessions will be hosted for the Embodied AI & Humanoid Robotics, NEV, and Advanced Medical Semiconductor sectors. Supported by pre-arranged supply and sourcing requirements from across the value chain, the program will feature product launches, executive presentations, and private one-to-one business meetings, enabling targeted connections between leading OEMs and upstream semiconductor, equipment, and material suppliers to accelerate technology commercialization and strategic collaboration.

•  New Product Launches & Technology Presentation Stage

All exhibitors may apply for complimentary presentation slots to showcase new products and innovative technologies to buyers, investors, and industry experts, enhancing product visibility and market recognition.

• One-to-One Business Matchmaking

Based on exhibitors' offerings and buyers' sourcing requirements collected in advance, the organizer will arrange targeted business meetings in dedicated private meeting areas, facilitating efficient business negotiations, partnership development, and project collaboration.

• Integrated Talent Recruitment & Development Platform

In partnership with leading universities and professional talent organizations, the exhibition will host dedicated recruitment activities while connecting exhibitors with talent development programs, innovation incubators, and government support initiatives.

• Investment & Financing Matchmaking Platform

The exhibition brings together leading semiconductor-focused venture capital firms and investment institutions to facilitate investment matchmaking for promising IC design companies, semiconductor equipment and materials startups, and technology upgrade projects, creating efficient pathways to strategic investment and long-term growth.

V. Major Exhibits

•  IC Design / Chips and Applications: IC and related electronic product design, EDA, AI computing power chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products in the fields of the Internet of Things (IoT), AI, automotive electronics, smart cities, smart terminals, healthcare, etc.

•  IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging, and testing technologies and products, etc.

•  Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), fan-out wafer-level packaging, as well as related design, materials, testing, and equipment, etc.

•  Wafer Equipment / Packaging and Testing Equipment: Precision equipment and semiconductor packaging equipment required for wafer processing, semiconductor testing equipment, IC testing instruments, equipment for advanced packaging processes (such as SiP and 3D packaging), and power device equipment, etc.

•  Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, as well as upstream equipment and materials, etc.

•  Semiconductor Materials: Monocrystalline silicon, wafers and silicon-based materials, polishing pads, photomasks, sputtering targets, polishing slurries, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.

•  Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC components, robots, quartz components, filters, RF power supplies, ceramic components, ESC electrostatic chucks, pressure gauges, pumps, MFC flow controllers, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, cooling equipment, induction heaters, etc.

•  AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, etc.

Supporting Facilities and Services: Product support/cleanrooms, general business services/consulting, sales and services, standards, etc.

VI. Exhibition Areas

•  IC Design / Chips and Applications Pavilion

•  C Manufacturing Pavilion

•  Wafer Equipment Pavilion

•  Packaging and Testing Equipment Pavilion

•  Core Components and Materials Pavilion

•  Compound Semiconductors and Power Devices Pavilion

•  AI Computing Power Pavilion

•  Supporting Facilities and Services Pavilion

•  Provincial and Municipal Pavilions & Regional Clusters Pavilion

Focusing on the latest breakthroughs in “high-end chips” and “domestic substitution,” the event strives to provide a cutting-edge platform for showcasing industry-leading technologies.

VII. Target Audiences

It will attract professionals from around the world in semiconductors, IC, electronic power, electronics manufacturing, display manufacturing, as well as automotive, aerospace, healthcare, information and communications, and consumer electronics to participate in the exhibition. The event provides an efficient platform for participants to explore cutting-edge technologies, discuss collaborative strategies, jointly decode the new industrial ecosystem, and work together to build an open, collaborative, and resilient core future for the global semiconductor and IC industry.

VIII. Booth Reservation

Your timely reservation will allow us to preassign exhibit space. Requests for exhibit space will be accepted on a “first come, first served” basis.

To reserve the booth of “SICE 2027” or learn more information, please contact:

Tel : (86-21) 5013-1760

E-mail: info@goldenexpo.com.cn